恩智浦移动NFC无现金支付解决方案在印度实现商用

发布时间:2012-10-24 阅读量:743 来源: 我爱方案网 作者:

【导读】Identive Group和恩智浦半导体宣布成为Yeldi Softcom Pvt Ltd创新型近距离无线通信(NFC)支付标签的供应商,以支持其在印度发布“ara eTap”无现金支付应用。NFC支付标签粘附在移动电话背面,可实现无现金“即触即付”式交易。

“Mobile technology is rapidly being adopted by a broad demographic in India, which is spurring significant interest in mobile commerce,” said Lakshmi Deepa, chief executive officer of Yeldi Softcom, a subsidiary of the Yeldi Group that focuses on the development of telecommunications technology. “The NFC payment tags from Identive and NXP make it possible for us to equip Indian consumers with the means of making cashless payments and other transactions without the need for a more expensive smart phone with in-built NFC. The tags can be used with both new and existing mobile phones, making the ara eTap application available to the majority of the population. Transactions are secure and the ability to reload cash to the tag adds to the convenience.”

With targeted deployment of 300,000 mobile phones and millions of NFC tags, Yeldi Softcom aims to speed the transition from cumbersome, cash-based transactions to a world of convenient mobile payments for Indian consumers. ara eTap customers can use the NFC payment tag to load cash onto their phones from their personal bank accounts or from a special escrow account set up with Yeldi Softcom. In addition to paying for retail items, tag holders can use the application to pay utility bills, recharge mobiles or book movie and travel tickets, and also can earn reward points on every usage. Yeldi Softcom expects to launch ara eTap in the coming months and is currently signing up merchants across India to distribute the NFC payment tags and support the cashless payment application. To address Yeldi Softcom’s requirements for the ara eTap program, Identive developed a unique NFC payment tag based on its patent-pending tom (tag on metal) smart inlay technology, which shields the tag’s radio frequency signal from the metal in the mobile phone to allow a reliable, high-performance connection between the tag and phone. The tag is manufactured using an abrasion-resistant surface and unique printing process that offers unsurpassed protection and longevity when deployed on mobile phones in the field.

For the chip technology within the tag, Identive worked closely with its longstanding tag IC provider NXP Semiconductors, the co-inventor and market leader of NFC. “Yeldi´s new ara eTap is a major step forward for micro cashless payment in India and beyond. NXP, the leader in the global identification market, provides Identive and Yeldi with a complete payment solution based on our secure MIFARE DESFire platform and award winning PN65 mobile transaction IC. The MIFARE DESFire ICs for Identive´s Yeldi project are NFC tag type 4 compliant and already successfully used in the New Delhi, Bengaluru and Mumbai transport ticketing schemes,” said Martin Gruber, general manager, MIFARE product line, NXP Semiconductors.

“Identive has made a significant investment in developing innovative NFC technology to support cashless payment applications such as ara eTap and we are pleased to support the launch of this ground-breaking program,” said Dr. Manfred Mueller, COO of identification products for Identive.

At SmartCards Expo 2012 (NSIC Exhibition Ground, Okhla Industrial Estate, New Delhi, October 10-12) visitors can learn more about Yeldi’s Mobile NFC Cashless Payment Solution at the NXP booth (#A1) as well as Identive’s booth (#C1).
相关资讯
Diodes Q2财务报告:营收超预期增长,连续三季度同比上扬

Diodes公司近期公布了截至2025年6月30日的第二季度财务业绩,标志着其连续三个季度实现同比增长,显示出半导体市场的稳步复苏。根据报告,该公司在多个关键财务指标上表现稳健,受益于全球需求的逐步回升和市场结构优化。公司高层认为,这一业绩源于亚洲地区的强劲拉动和产品组合的适应性调整。

MACOM Q3营收同比激增32.3%,射频芯片龙头再创增长新高

美国射频半导体龙头企业MACOM Technology Solutions于8月7日正式公布截至2025年7月4日的第三财季业绩报告。财报显示,当季实现营收2.521亿美元,较去年同期大幅增长32.3%,创下近三年最高单季增速。

Microchip复苏计划成效显著:Q1营收环比增10.8%,库存大幅优化,AI/国防订单强劲

美国微芯科技公司(Microchip Technology)于8月7日发布了其2026财年第一季度(截至2025年6月30日)的财务报告。报告显示,公司业绩呈现显著复苏迹象,多项关键指标环比改善,并超出此前修订后的业绩指引。

产需趋向平衡!赛力斯7月新能源销量占比突破93%

8月8日,赛力斯集团(601127)公布2025年7月产销快报。数据显示,尽管整体市场仍承压,集团在主力新能源汽车板块显现增长韧性,单月销量同比提升5.7%,而传统燃油车型业务持续收缩,反映出业务转型的深化推进。

INS1011SD + VGaN™:颠覆传统BMS的低边保护方案

在追求更高效率、更小体积和更低成本的电力电子系统发展趋势下,传统的硅基(Si)功率器件,特别是在双向能量流动应用(如电池管理系统BMS)中常用的背靠背MOSFET方案,逐渐显现出性能瓶颈。氮化镓(VGaN™)器件凭借其卓越的开关速度、低导通电阻和更小的尺寸,成为理想的替代者。然而,充分发挥VGaN™的潜力需要与之高度匹配的专用驱动芯片。英诺赛科(Innoscience)作为全球领先的VGaN™ IDM厂商,推出全球首款100V低边驱动芯片INS1011SD,标志着“VGaN™+专用驱动”完整解决方案的成熟,为双向电力电子系统设计带来革命性突破。